PackageSSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP TDA9887TS/V4,112 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
8.4(Max)
Package Width (mm)
5.4(Max)
Package Height (mm)
1.8(Max)
Seated Plane Height (mm)
2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-150AG
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA9887TS/V4,112 Datasheet
Download the complete datasheet for NXP TDA9887TS/V4,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.