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Technical Specifications
NXP TDA9899HN/V2,518 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
48
PCB
48
Package Length (mm)
7.1(Max)
Package Width (mm)
7.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-243VKKD
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA9899HN/V2,518 Datasheet
Download the complete datasheet for NXP TDA9899HN/V2,518 to view detailed technical specifications.
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