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Technical Specifications
NXP TDA9989ET/C1,551 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 4.5 |
| Package Width (mm) | 4.5 |
| Package Height (mm) | 0.7 |
| Seated Plane Height (mm) | 0.95 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA9989ET/C1,551 Datasheet
Download the complete datasheet for NXP TDA9989ET/C1,551 to view detailed technical specifications.
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