NXP
TDF8591TH/N1,118
Audio Amp Speaker 1-CH Mono/2-CH Stereo 310W Class-D Automotive 24-Pin HSOP EP T/R
PackageHSOP EP
MountingSurface Mount
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Technical Specifications
NXP TDF8591TH/N1,118 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
HSOP EP
Package Description
Heat Sinked Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
16(Max)
Package Width (mm)
11.1(Max)
Package Height (mm)
3.5(Max)
Seated Plane Height (mm)
3.5(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Function
Speaker
Amplifier Type
Class-D
Input Signal Type
Single
Output Signal Type
Differential|Single
Output Type
1-Channel Mono|2-Channel Stereo
Maximum Output Current
12000mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDF8591TH/N1,118 Datasheet
Download the complete datasheet for NXP TDF8591TH/N1,118 to view detailed technical specifications.
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