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Technical Specifications
NXP TEA1094/C3 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
28
PCB
28
Package Length (mm)
36(Max)
Package Width (mm)
14.1(Max)
Package Height (mm)
4(Max)
Package Material
Plastic
Mounting
Through Hole
Category
Standard
Application
Answering Machines|Battery or Line-Powered Telephone Sets with Hands-Free|Cordless Telephones|Fax Machines|listening-In Functions
Maximum Receiver Gain
21dB
Maximum Transmitter Gain
18dB
Min Operating Temperature
-25°C
Max Operating Temperature
75°C
Max Operating Supply Voltage
12V
Min Operating Supply Voltage
3.3V
Supply Current
4.4mA
Typical Supply Current
3.1mA
Typical Operating Supply Voltage
5|9V
Compliance
Cage Code
H1R01
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP TEA1094/C3 Datasheet
Download the complete datasheet for NXP TEA1094/C3 to view detailed technical specifications.
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