PackageSO
Current1.4mA
MountingSurface Mount
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Technical Specifications
NXP TEA1110AT/C1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
14
PCB
14
Package Length (mm)
8.75(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.45(Max)
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Category
Standard
Application
Answering Machines|Cordless Telephones|Fax Machines|Telephone Sets
Maximum Receiver Gain
34dB
Maximum Transmitter Gain
44.7dB
Min Operating Temperature
-25°C
Max Operating Temperature
75°C
Supply Current
1.4mA
Typical Supply Current
1.1mA
Typical Operating Supply Voltage
2.9V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TEA1110AT/C1 Datasheet
Download the complete datasheet for NXP TEA1110AT/C1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.