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Technical Specifications
NXP TEA1112AT/C1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
5(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.55(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-137AB
Category
Advanced
Application
Answering Machines|Cordless Telephones|Fax Machines|Telephone Sets
Maximum Receiver Gain
32.7dB
Maximum Transmitter Gain
53dB
Min Operating Temperature
-25°C
Max Operating Temperature
75°C
Supply Current
1.4mA
Typical Supply Current
1.15mA
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TEA1112AT/C1 Datasheet
Download the complete datasheet for NXP TEA1112AT/C1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.