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Technical Specifications
NXP TEA1112AT/C1 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 5(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.55(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-137AB |
| Category | Advanced |
| Application | Answering Machines|Cordless Telephones|Fax Machines|Telephone Sets |
| Maximum Receiver Gain | 32.7dB |
| Maximum Transmitter Gain | 53dB |
| Min Operating Temperature | -25°C |
| Max Operating Temperature | 75°C |
| Supply Current | 1.4mA |
| Typical Supply Current | 1.15mA |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TEA1112AT/C1 Datasheet
Download the complete datasheet for NXP TEA1112AT/C1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.