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Technical Specifications
NXP TEA1112T/C1 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOP |
| Package Description | Plastic Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 10.5(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.5(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Standard |
| Application | Answering Machines|Cordless Telephones|Fax Machines|Line Powered Telephone Sets |
| Maximum Receiver Gain | 32.7dB |
| Maximum Transmitter Gain | 53dB |
| Supply Current | 19.5mA |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TEA1112T/C1 Datasheet
Download the complete datasheet for NXP TEA1112T/C1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.