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Technical Specifications
NXP TEA1522P/N2.112 technical specifications.
General
| Package/Case | DIP |
| Contact Plating | Gold |
| Drain to Source Resistance | 12R |
| Lead Free | Lead Free |
| Max Duty Cycle | 75% |
| Max Input Voltage (AC) | 276V |
| Min Input Voltage (AC) | 80V |
| Max Input Voltage | 276V |
| Min Input Voltage | 80V |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -20°C |
| Mount | Through Hole |
| Output Power | 30W |
| Packaging | Cut Tape |
| Power Dissipation | 1W |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| Resistance | 12R |
| Topology | Flyback |
| Weight | 2.26799g |
Compliance
| RoHS | Compliant |
Datasheet
NXP TEA1522P/N2.112 Datasheet
Download the complete datasheet for NXP TEA1522P/N2.112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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