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Technical Specifications
NXP TEA1532AP/N1,112 technical specifications.
General
| Package/Case | DIP |
| Lead Free | Lead Free |
| Max Operating Temperature | 145°C |
| Min Operating Temperature | -20°C |
| Mount | Through Hole |
| Package Quantity | 50 |
| Packaging | Rail/Tube |
| RoHS Compliant | Yes |
| Series | GreenChip™ II |
Compliance
| RoHS | Compliant |
Datasheet
NXP TEA1532AP/N1,112 Datasheet
Download the complete datasheet for NXP TEA1532AP/N1,112 to view detailed technical specifications.
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