The TEA1552T/N1/DG,518 is a 14-pin SO lead-frame SMT power management IC with a package length of 8.75mm, width of 4mm, and height of 1.45mm. It has a seated plane height of 1.75mm and a pin pitch of 1.27mm. The IC is mounted on the surface and made of plastic. It belongs to the category of AC/DC converters and offline switchers, specifically a power management IC.
PackageSO
MountingSurface Mount
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Technical Specifications
NXP TEA1552T/N1/DG,518 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SO |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.75(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.45(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TEA1552T/N1/DG,518 Datasheet
Download the complete datasheet for NXP TEA1552T/N1/DG,518 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.