PackagePDIP
MountingThrough Hole
Quick Jump:
Technical Specifications
NXP TEA1622P/N1,112 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
8
PCB
8
Package Length (mm)
9.8(Max)
Package Width (mm)
6.48(Max)
Package Height (mm)
3.2(Max)
Seated Plane Height (mm)
4.2(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Topology
Flyback
Minimum Supply Voltage
-0.4V
Maximum Supply Voltage
40V
Typical Inrush Current
180uA
Min Operating Temperature
-20°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TEA1622P/N1,112 Datasheet
Download the complete datasheet for NXP TEA1622P/N1,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.