PackageTSOP
MountingSurface Mount
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Technical Specifications
NXP TEA1731TS/1,115 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
6
PCB
6
Package Length (mm)
3.1(Max)
Package Width (mm)
1.7(Max)
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.95
Package Material
Plastic
Mounting
Surface Mount
Topology
Flyback
Minimum Supply Voltage
-0.4V
Maximum Supply Voltage
35V
Min Operating Temperature
-40°C
Max Operating Temperature
150°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TEA1731TS/1,115 Datasheet
Download the complete datasheet for NXP TEA1731TS/1,115 to view detailed technical specifications.
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