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Technical Specifications
NXP TEA1733CP/N1,112 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
8
PCB
8
Package Length (mm)
9.8(Max)
Package Width (mm)
6.48(Max)
Package Height (mm)
3.2(Max)
Seated Plane Height (mm)
4.2(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TEA1733CP/N1,112 Datasheet
Download the complete datasheet for NXP TEA1733CP/N1,112 to view detailed technical specifications.
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