The TEA1750T/N1/DG is a flyback power management IC from NXP, designed for surface mount applications. It features a maximum operating temperature of 150°C and a minimum operating temperature of -40°C. The device is RoHS compliant and has a maximum power dissipation of 250W. It is available in a SO package with a height of 1.45mm and a width of 4mm.
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| Package/Case | SO |
| Fault Protection | Over Voltage, Over Temperature |
| Height | 1.45mm |
| Lead Free | Lead Free |
| Length | 10mm |
| Max Duty Cycle | 10% |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 250W |
| Max Supply Current | 3.75mA |
| Max Supply Voltage | 276V |
| Mount | Surface Mount |
| Output Current | -80uA |
| Output Power | 600mW |
| Output Voltage | 12V |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | GreenChip™ III |
| Topology | Flyback |
| Weight | 0.007079oz |
| Width | 4mm |
| RoHS | Compliant |
Download the complete datasheet for NXP TEA1750T/N1/DG,518 to view detailed technical specifications.
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