Quick Jump:
Technical Specifications
NXP TEA1752LT/N1/S1,51 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
10(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.45(Max)
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TEA1752LT/N1/S1,51 Datasheet
Download the complete datasheet for NXP TEA1752LT/N1/S1,51 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.