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Technical Specifications
NXP TEA18361LT/1J technical specifications.
General
| Package/Case | SOIC |
| Fault Protection | Over Voltage, Over Temperature |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 75W |
| Mount | Surface Mount |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| Series | GreenChip™ |
| Topology | Flyback |
Compliance
| RoHS | Compliant |
Datasheet
NXP TEA18361LT/1J Datasheet
Download the complete datasheet for NXP TEA18361LT/1J to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.