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Technical Specifications
NXP TEA5880TS/N1,112 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
8.4(Max)
Package Width (mm)
5.4(Max)
Package Height (mm)
1.8(Max)
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-150AG
Compliance
Cage Code
H1R01
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP TEA5880TS/N1,112 Datasheet
Download the complete datasheet for NXP TEA5880TS/N1,112 to view detailed technical specifications.
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