PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP TEA6886HL/V2,518 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
80
PCB
80
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BDD
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TEA6886HL/V2,518 Datasheet
Download the complete datasheet for NXP TEA6886HL/V2,518 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.