PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP TEA6886HL/V2,557 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
80
PCB
80
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
1.4
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BDD
Compliance
Cage Code
H1R01
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP TEA6886HL/V2,557 Datasheet
Download the complete datasheet for NXP TEA6886HL/V2,557 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.