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Technical Specifications
NXP TEF6890H/V3,557 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
PQFP
Package Description
Plastic Quad Flat Package
Lead Shape
Gull-wing
Pin Count
44
PCB
44
Package Length (mm)
10.1(Max)
Package Width (mm)
10.1(Max)
Package Height (mm)
1.85(Max)
Seated Plane Height (mm)
2.1(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TEF6890H/V3,557 Datasheet
Download the complete datasheet for NXP TEF6890H/V3,557 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.