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Technical Specifications
NXP TFA9887UK technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 29 |
| PCB | 29 |
| Package Length (mm) | 3.19 |
| Package Width (mm) | 2.07 |
| Package Height (mm) | 0.36 |
| Seated Plane Height (mm) | 0.6(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Function | Speaker |
| Amplifier Type | Class-D |
| Typical PSRR | 90dB |
| Input Signal Type | Single |
| Output Signal Type | Differential |
| Output Type | 1-Channel Mono |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TFA9887UK Datasheet
Download the complete datasheet for NXP TFA9887UK to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.