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Technical Specifications
NXP UBA1702T/C1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
18.1(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.45(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013
Category
Interrupter Driver
Min Operating Temperature
-25°C
Max Operating Temperature
75°C
Compliance
Cage Code
H1R01
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP UBA1702T/C1 Datasheet
Download the complete datasheet for NXP UBA1702T/C1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.