28-pin SO package, lead-frame SMT with gull-wing leads, this integrated circuit is designed for cordless telephone applications. It features a small outline IC package with a 1.27mm pin pitch, measuring 18.1mm maximum length, 7.6mm maximum width, and 2.45mm maximum height. Operating within a 3V to 5.5V supply voltage range, it consumes a typical supply current of 2.2mA. This plastic, surface-mount component is suitable for cable, copper, and twisted pair transmission media, with an operating temperature range of -25°C to 75°C.
PackageSO
MountingSurface Mount
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Technical Specifications
NXP UBA1707TD technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SO |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 18.1(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.45(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AE |
| Category | Cordless Telephone |
| Transmission Media Type | Cable|Copper|Twisted Pair |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Supply Voltage | 3V |
| Power Supply Type | Analog |
| Typical Supply Current | 2.2mA |
| Min Operating Temperature | -25°C |
| Max Operating Temperature | 75°C |
| Typical Operating Supply Voltage | 3.3|5V |
Compliance
| Cage Code | H1R01 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP UBA1707TD Datasheet
Download the complete datasheet for NXP UBA1707TD to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.