28-pin SO package, lead-frame SMT with gull-wing leads, this integrated circuit is designed for cordless telephone applications. It features a small outline IC package with a 1.27mm pin pitch, measuring 18.1mm maximum length, 7.6mm maximum width, and 2.45mm maximum height. Operating within a 3V to 5.5V supply voltage range, it consumes a typical supply current of 2.2mA. This plastic, surface-mount component is suitable for cable, copper, and twisted pair transmission media, with an operating temperature range of -25°C to 75°C.
PackageSO
MountingSurface Mount
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Technical Specifications
NXP UBA1707TD technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
18.1(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.45(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AE
Category
Cordless Telephone
Transmission Media Type
Cable|Copper|Twisted Pair
Max Operating Supply Voltage
5.5V
Min Operating Supply Voltage
3V
Power Supply Type
Analog
Typical Supply Current
2.2mA
Min Operating Temperature
-25°C
Max Operating Temperature
75°C
Typical Operating Supply Voltage
3.3|5V
Compliance
Cage Code
H1R01
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP UBA1707TD Datasheet
Download the complete datasheet for NXP UBA1707TD to view detailed technical specifications.
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