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Technical Specifications
NXP UJA1018TK technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
SON
Package/Case
HVSON EP
Package Description
Heat Sinked Very Thin Small Outline No Lead, Exposed Pad
Lead Shape
No Lead
Pin Count
16
PCB
16
Package Length (mm)
5.5
Package Width (mm)
3.5
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-229
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP UJA1018TK Datasheet
Download the complete datasheet for NXP UJA1018TK to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.