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Technical Specifications
NXP UJA1018TK,118 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | SON |
| Package/Case | HVSON EP |
| Package Description | Heat Sinked Very Thin Small Outline No Lead, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 5.5 |
| Package Width (mm) | 3.5 |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-229 |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP UJA1018TK,118 Datasheet
Download the complete datasheet for NXP UJA1018TK,118 to view detailed technical specifications.
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