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Technical Specifications
NXP UJA1061TW/3V3/C technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
HTSSOP EP
Package Description
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
11.1(Max)
Package Width (mm)
6.2(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153DCT
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP UJA1061TW/3V3/C Datasheet
Download the complete datasheet for NXP UJA1061TW/3V3/C to view detailed technical specifications.
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