Quick Jump:
Technical Specifications
NXP UJA1075TW/3V3 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
HTSSOP EP
Package Description
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad
Pin Count
32
PCB
32
Package Length (mm)
11.1(Max)
Package Width (mm)
6.2(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP UJA1075TW/3V3 Datasheet
Download the complete datasheet for NXP UJA1075TW/3V3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.