NXP
X3G-OH048,005
Angular Magnetoresistive Sensor 25KA/m Magnetic Field Automotive 6-Pin Bare Die Wafer
PackageBare Die
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Technical Specifications
NXP X3G-OH048,005 technical specifications.
General
Package Family Name
Die
Package/Case
Bare Die
Pin Count
6
PCB
6
Package Length (mm)
1.15
Package Width (mm)
1.15
Type
Angular
Number of Bridge per Chip
2
Maximum Bridge Resistance
3.7kOhm
Max Operating Supply Voltage
9V
Min Operating Temperature
-40°C
Max Operating Temperature
150°C
Module/IC Classification
IC
Maximum Magnetic Field
25KA/m(Min)
Typical Operating Supply Voltage
5V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP X3G-OH048,005 Datasheet
Download the complete datasheet for NXP X3G-OH048,005 to view detailed technical specifications.
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