24-bit fixed-point digital signal processor (DSP) operating at 150MHz. Features a 196-pin BGA package with surface mount capability, measuring 15mm x 15mm x 1.44mm. Includes 384KB RAM and 34 programmable I/Os, with a ROMLess program memory type. Supports dual operating supply voltages of 1.8V or 3.3V and operates within a temperature range of 0°C to 100°C.
PackageBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP XC56311GC150 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
196
PCB
196
Package Length (mm)
15
Package Width (mm)
15
Package Height (mm)
1.44(Max)
Package Material
Plastic
Mounting
Surface Mount
Data Bus Width
24bit
Numeric and Arithmetic Format
Fixed-Point
Device Core
DSP56300
Program Memory Type
ROMLess
RAM Size
384KB
Maximum Speed
150MHz
Number of Programmable I/Os
34
Device Input Clock Speed
150MHz
Typical Operating Supply Voltage
1.8|3.3V
Min Operating Temperature
0°C
Max Operating Temperature
100°C
Interface Type
SCI
I2C
0
CAN
0
UART
0
Ethernet
0
USART
0
USB
0
SPI
0
I2S
0
Programmability
No
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP XC56311GC150 Datasheet
Download the complete datasheet for NXP XC56311GC150 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.