24-bit fixed-point digital signal processor (DSP) operating at 150MHz. Features a 196-pin BGA package with surface mount capability, measuring 15mm x 15mm x 1.44mm. Includes 384KB RAM and 34 programmable I/Os, with a ROMLess program memory type. Supports dual operating supply voltages of 1.8V or 3.3V and operates within a temperature range of 0°C to 100°C.
PackageBGA
MountingSurface Mount
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Technical Specifications
NXP XC56311GC150 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 196 |
| PCB | 196 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Height (mm) | 1.44(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Data Bus Width | 24bit |
| Numeric and Arithmetic Format | Fixed-Point |
| Device Core | DSP56300 |
| Program Memory Type | ROMLess |
| RAM Size | 384KB |
| Maximum Speed | 150MHz |
| Number of Programmable I/Os | 34 |
| Device Input Clock Speed | 150MHz |
| Typical Operating Supply Voltage | 1.8|3.3V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 100°C |
| Interface Type | SCI |
| I2C | 0 |
| CAN | 0 |
| UART | 0 |
| Ethernet | 0 |
| USART | 0 |
| USB | 0 |
| SPI | 0 |
| I2S | 0 |
| Programmability | No |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP XC56311GC150 Datasheet
Download the complete datasheet for NXP XC56311GC150 to view detailed technical specifications.
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