The ASM3P2508AF-08SR is an 8-pin SOIC package clock generator from Onsemi, featuring a lead-frame SMT package with a small outline IC narrow body and gull-wing leads. It is designed for surface mount applications with a maximum package length of 5mm, width of 4mm, and height of 1.5mm. The device has a seated plane height of 1.75mm and a pin pitch of 1.27mm. It is suitable for use in clock and timing applications, with an input logic level of crystal.
PackageSOIC N
MountingSurface Mount
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Technical Specifications
Onsemi ASM3P2508AF-08SR technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC N |
| Package Description | Small Outline IC Narrow Body |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 5(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AA |
| Number of Outputs per Chip | 2 |
| Input Logic Level | Crystal |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Onsemi ASM3P2508AF-08SR Datasheet
Download the complete datasheet for Onsemi ASM3P2508AF-08SR to view detailed technical specifications.
No datasheet is available for this part.