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Technical Specifications
Onsemi ESDR0502NMUTBG technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DFN |
| Package/Case | UDFN |
| Package Description | Micro Dual Flat Package No Lead |
| Lead Shape | No Lead |
| Pin Count | 6 |
| PCB | 6 |
| Package Length (mm) | 1.2 |
| Package Width (mm) | 1 |
| Package Height (mm) | 0.5(Max) |
| Seated Plane Height (mm) | 0.55(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Configuration | Triple |
| Type | Diode Array |
| Direction Type | Uni-Directional |
| Maximum Working Voltage | 5.5V |
| Maximum Leakage Current | 1uA |
| Number of Elements per Chip | 3 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8536308000 |
| Schedule B | 8536300000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi ESDR0502NMUTBG Datasheet
Download the complete datasheet for Onsemi ESDR0502NMUTBG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.