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Technical Specifications
Onsemi FPF1103 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 4 |
| PCB | 4 |
| Package Length (mm) | 1.1 |
| Package Width (mm) | 1.1 |
| Package Height (mm) | 0.33 |
| Seated Plane Height (mm) | 0.63(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Number of Outputs | 1 |
| Switch On Resistance | 0.085Ohm |
| Maximum Input Voltage | 4V |
| Maximum Power Dissipation | 1000mW |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Output Voltage Range | -0.3 to 4.2V |
| Operating Supply Voltage Range | 1.2 to 4V |
| Minimum Input Voltage | 1.2V |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi FPF1103 Datasheet
Download the complete datasheet for Onsemi FPF1103 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.