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Technical Specifications
Onsemi FPF1108 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
4
PCB
4
Package Length (mm)
1.1
Package Width (mm)
1.1
Package Height (mm)
0.33
Seated Plane Height (mm)
0.63(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Number of Outputs
1
Switch On Resistance
0.085Ohm
Maximum Input Voltage
4V
Maximum Power Dissipation
1000mW
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Output Voltage Range
-0.3 to 4.2V
Operating Supply Voltage Range
1.2 to 4V
Minimum Input Voltage
1.2V
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi FPF1108 Datasheet
Download the complete datasheet for Onsemi FPF1108 to view detailed technical specifications.
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