1-output power switch with a 2.2A maximum current rating and 0.185 Ohm switch on resistance. Features a 4-pin WLCSP (Wafer Level Chip Scale Package) with a 0.76mm x 0.76mm footprint and 0.4mm pin pitch. Operates from a 1.2V to 5.5V supply voltage, with a maximum input voltage of 5.5V and an output voltage range of -0.3V to 6V. Surface mountable with a maximum power dissipation of 1000mW, suitable for operation between -40°C and 85°C.
PackageWLCSP
MountingSurface Mount
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Technical Specifications
Onsemi FPF1204BUCX technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
4
PCB
4
Package Length (mm)
0.76
Package Width (mm)
0.76
Package Height (mm)
0.29
Seated Plane Height (mm)
0.54(Max)
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Number of Outputs
1
Minimum Output Current
2.2(Max)A
Switch On Resistance
0.185Ohm
Maximum Input Voltage
5.5V
Maximum Power Dissipation
1000mW
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Output Voltage Range
-0.3 to 6V
Operating Supply Voltage Range
1.2 to 5.5V
Minimum Input Voltage
1.2V
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi FPF1204BUCX Datasheet
Download the complete datasheet for Onsemi FPF1204BUCX to view detailed technical specifications.
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