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Technical Specifications
Onsemi LV5216CS technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLP
Package Description
Wafer Level Package
Lead Shape
Ball
Pin Count
36
PCB
36
Package Length (mm)
2.97
Package Width (mm)
2.97
Package Height (mm)
0.55(Max) - 0.14
Seated Plane Height (mm)
0.55(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Number of Segments
3
Output Voltage
5(Typ)V
Min Operating Temperature
-30°C
Max Operating Temperature
75°C
Max Operating Supply Voltage
4.5V
Maximum Power Dissipation
850mW
Min Operating Supply Voltage
1.7V
Typical Operating Supply Voltage
1.8|2.5|3.3V
Compliance
Cage Code
5V1P1
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi LV5216CS Datasheet
Download the complete datasheet for Onsemi LV5216CS to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.