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Technical Specifications
Onsemi LV8481CS technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLP
Package Description
Wafer Level Package
Lead Shape
Ball
Pin Count
10
PCB
10
Package Length (mm)
1.47
Package Width (mm)
0.97
Package Height (mm)
0.5(Max) - 0.14
Seated Plane Height (mm)
0.5(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Current Driver
Min Operating Supply Voltage
2.4V
Max Operating Supply Voltage
4.5V
Maximum Operating Current
1.8mA
Min Operating Temperature
-30°C
Max Operating Temperature
85°C
Compliance
Cage Code
5V1P1
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Onsemi LV8481CS Datasheet
Download the complete datasheet for Onsemi LV8481CS to view detailed technical specifications.
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