PackageDFN EP
MountingSurface Mount
Quick Jump:
Technical Specifications
Onsemi MC100ELT25MNR4G technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DFN
Package/Case
DFN EP
Package Description
Dual Flat Package No Lead, Exposed Pad
Lead Shape
No Lead
Pin Count
8
PCB
8
Package Length (mm)
2
Package Width (mm)
2
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-229VCCD-3
Logic Family
ECL
Logic Function
Translator
Process Technology
ECL
Translation
ECL to TTL
Maximum Low Level Output Current
24mA
Maximum High Level Output Current
-3mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
5V1P1
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi MC100ELT25MNR4G Datasheet
Download the complete datasheet for Onsemi MC100ELT25MNR4G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.