PackagePLCC
MountingSurface Mount
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Technical Specifications
Onsemi MC100H605FN technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
LCC
Package/Case
PLCC
Package Description
Plastic Leaded Chip Carrier
Lead Shape
J-Lead
Pin Count
28
PCB
28
Package Length (mm)
11.58(Max)
Package Width (mm)
11.58(Max)
Package Height (mm)
3.69(Min)
Seated Plane Height (mm)
4.57(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-018AB
Logic Family
ECL
Logic Function
Registered Translator
Process Technology
ECL
Translation
ECL to TTL
Maximum Low Level Output Current
24mA
Maximum High Level Output Current
-24mA
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Compliance
Cage Code
5V1P1
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi MC100H605FN Datasheet
Download the complete datasheet for Onsemi MC100H605FN to view detailed technical specifications.
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