PackageSOIC N
MountingSurface Mount
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Technical Specifications
Onsemi MC100LVEL33D technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC N
Package Description
Small Outline IC Narrow Body
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
5(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.5(Max)
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AA
Type
Divider Buffer
Number of Outputs per Chip
1
Min Operating Supply Voltage
-3|3V
Max Operating Supply Voltage
-3.8|3.8V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
5V1P1
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi MC100LVEL33D Datasheet
Download the complete datasheet for Onsemi MC100LVEL33D to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.