PackagePLLC
MountingSurface Mount
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Technical Specifications
Onsemi MC10H124FN technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
LLCC
Package/Case
PLLC
Package Description
Plastic Leaded Chip Carrier
Lead Shape
J-Lead
Pin Count
20
PCB
20
Package Length (mm)
9.04(Max)
Package Width (mm)
9.04(Max)
Package Height (mm)
3.69(Min)
Seated Plane Height (mm)
4.57(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Logic Family
ECL
Logic Function
Translator
Process Technology
ECL
Translation
TTL to MECL
Maximum Low Level Output Current
50mA
Maximum High Level Output Current
-50mA
Min Operating Temperature
0°C
Max Operating Temperature
75°C
Compliance
Cage Code
5V1P1
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi MC10H124FN Datasheet
Download the complete datasheet for Onsemi MC10H124FN to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.