Automotive-grade 8-channel non-inverting buffer/line driver featuring 3-state CMOS logic. This surface-mount integrated circuit utilizes a thin shrink small outline package (TSSOP W) with 20 gull-wing leads on a 0.65mm pitch, measuring 6.6mm x 4.5mm x 1.05mm maximum dimensions. Operating from -40°C to 85°C, it offers 8 inputs and 8 outputs with 2 elements per chip.
PackageTSSOP W
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Onsemi MC74ACT244DT technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP W |
| Package Description | Thin Shrink Small Outline Package Wide |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 6.6(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AC |
| Logic Family | ACT |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Inputs per Chip | 8 |
| Number of Outputs per Chip | 8 |
| Process Technology | CMOS |
| Polarity | Non-Inverting |
| Output Type | 3-State |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi MC74ACT244DT Datasheet
Download the complete datasheet for Onsemi MC74ACT244DT to view detailed technical specifications.
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