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Technical Specifications
Onsemi MC74F11D technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
14
PCB
14
Package Length (mm)
8.75(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.5(Max)
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AB
Logic Family
F
Logic Function
AND
Process Technology
Bipolar
Number of Elements per Chip
3
Number of Element Inputs
3-IN
Number of Element Outputs
1
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
5V1P1
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi MC74F11D Datasheet
Download the complete datasheet for Onsemi MC74F11D to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.