Quick Jump:
Technical Specifications
Onsemi MC74HC1G00DTT3 technical specifications.
General
| Package Family Name | SOP |
| Package/Case | TSOP |
| Package Description | Thin Small Outline Package |
| Pin Count | 5 |
| PCB | 5 |
| Package Length (mm) | 3.15(Max) |
| Package Width (mm) | 1.65(Max) |
| Package Height (mm) | 1(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.95 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | HC |
| Logic Function | NAND |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 2-IN |
| Number of Element Outputs | 1 |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | 5V1P1 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Onsemi MC74HC1G00DTT3 Datasheet
Download the complete datasheet for Onsemi MC74HC1G00DTT3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.