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Technical Specifications
Onsemi MM74HC86J technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | CDIP |
| Package Description | Ceramic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 19.94(Max) |
| Package Width (mm) | 7.87(Max) |
| Package Height (mm) | 3.56(Max) |
| Seated Plane Height (mm) | 5.08(Max) |
| Package Material | Ceramic |
| Mounting | Through Hole |
| Jedec | MS-030AB |
| Logic Family | HC |
| Logic Function | XOR |
| Process Technology | CMOS |
| Number of Elements per Chip | 4 |
| Number of Element Inputs | 2-IN |
| Number of Element Outputs | 1 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 5V1P1 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Onsemi MM74HC86J Datasheet
Download the complete datasheet for Onsemi MM74HC86J to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.