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Technical Specifications
Onsemi NIS1050MNTBG technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DFN
Package/Case
WDFN EP
Package Description
Very Very Thin Dual Flat Package No Lead, Exposed Pad
Lead Shape
No Lead
Pin Count
6
PCB
6
Package Length (mm)
2
Package Width (mm)
2
Package Height (mm)
0.75(Max)
Seated Plane Height (mm)
0.8(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Category
Protection Interface Circuit
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
5V1P1
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi NIS1050MNTBG Datasheet
Download the complete datasheet for Onsemi NIS1050MNTBG to view detailed technical specifications.
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