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Technical Specifications
Onsemi NLX1G125FCT1G technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | Flip-Chip |
| Package/Case | Flip-Chip |
| Pin Count | 5 |
| PCB | 5 |
| Package Length (mm) | 1.4 |
| Package Width (mm) | 0.9 |
| Package Height (mm) | 0.31(Max) |
| Seated Plane Height (mm) | 0.5(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 1 |
| Number of Inputs per Chip | 1 |
| Number of Outputs per Chip | 1 |
| Process Technology | CMOS |
| Polarity | Non-Inverting |
| Output Type | 3-State |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi NLX1G125FCT1G Datasheet
Download the complete datasheet for Onsemi NLX1G125FCT1G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.