PackagePDIP
MountingThrough Hole
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Technical Specifications
Onsemi SN74LS51N technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
14
PCB
14
Package Length (mm)
19.56(Max)
Package Width (mm)
6.6(Max)
Package Height (mm)
3.68(Max)
Seated Plane Height (mm)
4.69(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Logic Family
LS
Logic Function
AND-OR-Invert
Process Technology
Bipolar
Number of Elements per Chip
2
Number of Element Inputs
2 Wide 2-IN/3-IN
Number of Element Outputs
1
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
5V1P1
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Onsemi SN74LS51N Datasheet
Download the complete datasheet for Onsemi SN74LS51N to view detailed technical specifications.
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