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Technical Specifications
Onsemi TND309TD-TL technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 3 |
| Package Width (mm) | 4.5 |
| Package Height (mm) | 0.95 |
| Seated Plane Height (mm) | 1 |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 5V1P1 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| RoHS Versions | 2002/95/EC |
Datasheet
Onsemi TND309TD-TL Datasheet
Download the complete datasheet for Onsemi TND309TD-TL to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.