The M55302/58LD66Y-21 is a wire-to-board connector with 66 RCP contacts, a 1.27mm terminal pitch, and a straight body orientation. It features a wire wrap termination method and a through-hole mounting style. The connector operates within a temperature range of -65°C to 125°C. It is designed for use in applications requiring a high number of contacts and a compact pitch.
MountingThrough Hole
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Technical Specifications
Airborn M55302/58LD66Y-21 technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 66 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Wire Wrap |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Height | 11.81mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Airborn M55302/58LD66Y-21 Datasheet
Download the complete datasheet for Airborn M55302/58LD66Y-21 to view detailed technical specifications.
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